Synthesis of silver nanorods and application for die attach material in devices

Silver nanorods have been successfully synthesized in high yield by a polyol process in the presence of FeCl(3). The yield and morphology of the silver particles from these conditions were dependant on the concentration of FeCl(3), and the molar ratio of the capping agent to AgNO(3). The optimized conditions for the synthesis of the nanorods were: 20 mu M of FeCl(3) and a molar ratio of 1.8:1 of capping agent to AgNO(3). The nanorods produced were used to form a silver layer at 400 A degrees C with a low electrical resistivity of 6.1 x 10(-6) Omega cm. The silver layer was applied as die-attachment films to connect a SiC chip to a copper substrate. This formed a porous structure, which was evaluated for structure and strength.