Effects of thermal annealing on structural and electrical properties of surface-activated n-GaSb/n-GaInP direct wafer bonds

Direct wafer bonding of highly conductive GaSb/GaInAs and GaSb/GaInP heterojunctions prepared by argon-beam surface activation

(2016) Felix Predan et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Solar cell efficiency tables (version 48)

(2016) Martin A. Green et al.   PROGRESS IN PHOTOVOLTAICS

Four-Junction Wafer-Bonded Concentrator Solar Cells

(2016) Frank Dimroth et al.   IEEE Journal of Photovoltaics

Transparent and electrically conductive GaSb/Si direct wafer bonding at low temperatures by argon-beam surface activation

(2015) F. Predan et al.   APPLIED SURFACE SCIENCE

Room-temperature GaAs/InP wafer bonding with extremely low resistance

(2014) Shiro Uchida et al.   Applied Physics Express

Fast atom beam-activated n-Si/n-GaAs wafer bonding with high interfacial transparency and electrical conductivity

(2013) S. Essig et al.   JOURNAL OF APPLIED PHYSICS

Aberration-corrected transmission electron microscopy analyses of GaAs/Si interfaces in wafer-bonded multi-junction solar cells

(2013) Dietrich Häussler et al.   ULTRAMICROSCOPY

Fast Atom Beam Activated Wafer Bonds between n-Si and n-GaAs with Low Resistance

(2013) S. Essig et al.   ECS Journal of Solid State Science and Technology

III-V/Si hybrid photonic devices by direct fusion bonding

(2012) Katsuaki Tanabe et al.   Scientific Reports

Heterogeneous Integration of Compound Semiconductors

(2010) Oussama Moutanabbir et al.   Annual Review of Materials Research

Interfacial Behavior of Surface Activated p-GaP/n-GaAs Bonded Wafers at Room Temperature

(2010) M. M. R. Howlader et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Nanobonding Technology Toward Electronic, Fluidic, and Photonic Systems Integration

(2010) M. M. R. Howlader et al.   IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS

Void-free strong bonding of surface activated silicon wafers from room temperature to annealing at 600°C

(2010) M.M.R. Howlader et al.   THIN SOLID FILMS