Low-Thermal-Budget Photonic Processing of Highly Conductive Cu Interconnects Based on CuO Nanoinks: Potential for Flexible Printed Electronics

Published 2016 View Full Article

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Title
Low-Thermal-Budget Photonic Processing of Highly Conductive Cu Interconnects Based on CuO Nanoinks: Potential for Flexible Printed Electronics
Authors
Keywords
-
Journal
ACS Applied Materials & Interfaces
Volume 8, Issue 3, Pages 2441-2448
Publisher
American Chemical Society (ACS)
Online
2016-01-01
DOI
10.1021/acsami.5b12156

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