Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips

Liquid Film Capillary Mechanism for Densification of Ceramic Powders during Flash Sintering

(2016) Rachman Chaim   Materials

Reconstruction and evaluation of the air permeability of a cement paste specimen with a void distribution gradient using CT images and numerical methods

(2015) Sang-Yeop Chung et al.   CONSTRUCTION AND BUILDING MATERIALS

High Junction Temperature and Low Parasitic Inductance Power Module Technology for Compact Power Conversion Systems

(2015) Satoshi Tanimoto et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

(2015) Hyunseok Oh et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Study and Handling Methods of Power IGBT Module Failures in Power Electronic Converter Systems

(2015) Ui-Min Choi et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Electrical method to measure the transient thermal impedance of insulated gate bipolar transistor module

(2015) Mei-Yu Wang et al.   IET Power Electronics

Spark Plasma Sintering of Commercial Zirconium Carbide Powders: Densification Behavior and Mechanical Properties

(2015) Xialu Wei et al.   Materials

Characterizations of Nanosilver Joints by Rapid Sintering at Low Temperature for Power Electronic Packaging

(2014)   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

(2014) Kongjing Li et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Low-current resistance spot welding of pure copper using silver oxide paste

(2014) Yuichiro Suzuki et al.   MATERIALS CHARACTERIZATION

Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

(2014) Shancan Fu et al.   MATERIALS LETTERS

Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging

(2013) Yunhui Mei et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

(2013) Luis A. Navarro et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Creep properties of low-temperature sintered nano-silver lap shear joints

(2013) Xin Li et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

(2013) Shuai Wang et al.   SCRIPTA MATERIALIA

Simplification of the Nanosilver Sintering Process for Large-Area Semiconductor Chip Bonding: Reduction of Hot-Pressing Temperature Below 200/spl deg/C

(2013) Kewei Xiao et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications

(2012) Hui Yu et al.   SCRIPTA MATERIALIA

Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test

(2012) Xin Li et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5$\,\times\,$5-${\rm mm}^{2}$ Chip Attachment

(2012) Gang Chen et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Low-Loss High-Performance Base-Drive Unit for SiC BJTs

(2011) Jacek Rabkowski et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Mechanical properties of nano-silver joints as die attach materials

(2011) Kim S. Siow   JOURNAL OF ALLOYS AND COMPOUNDS

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

(2010) Shaoyong Yang et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders

(2010) Hiroshi Ogura et al.   JOURNAL OF ELECTRONIC MATERIALS

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

(2009) T.G. Lei et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Coalescence of Silver Nanoparticles at Room Temperature: Unusual Crystal Structure Transformation and Dendrite Formation Induced by Self-Assembly

(2009) Michael Grouchko et al.   LANGMUIR

Accelerated active ageing test on SiC JFETs power module with silver joining technology for high temperature application

(2009) L. Dupont et al.   MICROELECTRONICS RELIABILITY

Reliability challenges of automotive power electronics

(2009) U. Scheuermann   MICROELECTRONICS RELIABILITY

Nanomechanics of Hall–Petch relationship in nanocrystalline materials

(2009) C.S. Pande et al.   PROGRESS IN MATERIALS SCIENCE

Low temperature, pressure-assisted sintering of nanoparticulate silver films

(2008) Andre D. Albert et al.   ACTA MATERIALIA

Effect of Microstructural Development on Mechanical and Electrical Properties of Inkjet-Printed Ag Films

(2008) Inyoung Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior

(2008) Yusuke Akada et al.   MATERIALS TRANSACTIONS

Electrical sintering of nanoparticle structures

(2008) Mark L Allen et al.   NANOTECHNOLOGY