Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing

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A Thickness Measurement System for Metal Films Based on Eddy-Current Method With Phase Detection

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Motor Power Signal Analysis for End-Point Detection of Chemical Mechanical Planarization

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Feature Analysis and Modeling of 670 nm Laser Optical Endpoint Traces in Tungsten CMP

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Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories

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Chemical mechanical polishing: Theory and experiment

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