Feature Analysis and Modeling of 670 nm Laser Optical Endpoint Traces in Tungsten CMP

Title
Feature Analysis and Modeling of 670 nm Laser Optical Endpoint Traces in Tungsten CMP
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
Volume 26, Issue 4, Pages 542-548
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2013-07-10
DOI
10.1109/tsm.2013.2271907

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