Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation

Published 2023 View Full Article

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Title
Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 150, Issue -, Pages 115097
Publisher
Elsevier BV
Online
2023-10-02
DOI
10.1016/j.microrel.2023.115097
References
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