Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation

出版年份 2016 全文链接

标题

作者

关键词

Airgap design, Ultra low-k dielectric (ULK), Interconnect, Finite element model (FEM), Capacitance

出版物

Volume 59, Issue -, Pages 102-107

出版商

Elsevier BV

发表日期

2016-02-01

DOI

10.1016/j.microrel.2016.01.015

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