Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates

Fractal analysis of surface topography in ground monocrystal sapphire

(2015) Qiuyan Wang et al.   APPLIED SURFACE SCIENCE

Warping of silicon wafers subjected to back-grinding process

(2015) Shang Gao et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size

(2015) Hyuk-Min Kim et al.   WEAR

Influence of mosaicity on the fracture behavior of sapphire

(2014) S. Graça et al.   ACTA MATERIALIA

Crystal Growth and Design of Sapphire: Experimental and Calculation Studies of Anisotropic Crystal Growth upon Pulling Directions

(2014) Congting Sun et al.   CRYSTAL GROWTH & DESIGN

Low temperature wet etching to reveal sub-surface damage in sapphire substrates

(2013) Purushottam Kumar et al.   APPLIED SURFACE SCIENCE

Design and evaluation of soft abrasive grinding wheels for silicon wafers

(2013) Shang Gao et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE

A case for 2-body material removal in prime LED sapphire substrate lapping and polishing

(2013) John J. Gagliardi et al.   Journal of Manufacturing Processes

Machining processes for sapphire wafers: a literature review

(2011) Z C Li et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE

Micro-Grooving Studies on Alumina Ceramic Material

(2010) D. Giridhar et al.   MATERIALS AND MANUFACTURING PROCESSES