Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling

Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heating

(2022) Mardiana Said et al.   Journal of Materials Research and Technology-JMR&T

Tin whiskers prefer to grow from the [001] grains in a tin coating on aluminum substrate

(2021) Shuang Tian et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Molecular dynamics simulation of the interfacial evolution and whisker growth of copper-tin coating under electrothermal coupling

(2021) Long Zhang et al.   COMPUTATIONAL MATERIALS SCIENCE

Modeling of growth rate and morphology mechanism of whisker and hillock on micro-bumps under temperature-pressure-humidity storage

(2021) Ke Lin et al.   SCRIPTA MATERIALIA

Phase-field study of IMC growth in Sn–Cu/Cu solder joints including elastoplastic effects

(2020) A. Durga et al.   ACTA MATERIALIA

A competition between stress triaxiality and joule heating on microstructure evolution and degradation of SnAgCu solder joints

(2020) Waluyo Adi Siswanto et al.   Journal of Manufacturing Processes

New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints

(2020) Peng Zhang et al.   MATERIALS & DESIGN

Whisker Growth in Sn Coatings: A Review of Current Status and Future Prospects

(2020) Piyush Jagtap et al.   JOURNAL OF ELECTRONIC MATERIALS

Atomistic analysis of the thermomechanical properties of Sn–Ag–Cu solder materials at the nanoscale with the MEAM potential

(2019) M. Motalab et al.   JOURNAL OF MOLECULAR MODELING

Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads

(2019) W. K. Le et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields

(2019) Yu Tian et al.   JOURNAL OF ELECTRONIC MATERIALS

Kinetics of the polymorphic phase transformation of Cu6Sn5

(2014) Guang Zeng et al.   ACTA MATERIALIA

Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics

(2011) Matthias Sobiech et al.   JOURNAL OF MATERIALS RESEARCH

Assessing the risk of “Kirkendall voiding” in Cu3Sn

(2010) Peter Borgesen et al.   MICROELECTRONICS RELIABILITY