Construction of a dual heterogeneous lamella structure to improve the electrical conductivity and mechanical properties of Cu alloys

Heterogeneous microstructure enables a synergy of strength, ductility and electrical conductivity in copper alloys

(2022) Zhenmin Lai et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A dual heterogeneous laminated microstructure design for improving the mechanical properties and electrical conductivity of copper alloys

(2022) Chaoping You et al.   MATERIALS CHARACTERIZATION

Nanoprecipitates induced dislocation pinning and multiplication strategy for designing high strength, plasticity and conductivity Cu alloys

(2021) Huiya Yang et al.   SCRIPTA MATERIALIA

High-strength and high-conductivity in situ Cu–TiB2 nanocomposites

(2021) Shuaihang Pan et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Preface to the viewpoint set on: Heterogeneous gradient and laminated materials

(2020) Lei Lu et al.   SCRIPTA MATERIALIA

Ductility and strain hardening in gradient and lamellar structured materials

(2020) Xiaolei Wu et al.   SCRIPTA MATERIALIA

Facile manufacturing of bimodal grained copper with nanoparticles

(2020) Gongcheng Yao et al.   MATERIALS LETTERS

Study on electrical behaviour of copper and its alloys containing dispersed nanoparticles

(2019) Shuaihang Pan et al.   CURRENT APPLIED PHYSICS

Microstructure and properties of high strength and high conductivity Cu-Cr alloy components fabricated by high power selective laser melting

(2018) Shasha Zhang et al.   MATERIALS LETTERS

Strain hardening in Fe–16Mn–10Al–0.86C–5Ni high specific strength steel

(2016) M.X. Yang et al.   ACTA MATERIALIA

Heterogeneous lamella structure unites ultrafine-grain strength with coarse-grain ductility

(2015) Xiaolei Wu et al.   PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA