Heterogeneous microstructure enables a synergy of strength, ductility and electrical conductivity in copper alloys
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Title
Heterogeneous microstructure enables a synergy of strength, ductility and electrical conductivity in copper alloys
Authors
Keywords
Copper alloy, Powder metallurgy, Mechanical properties, Electrical conductivity, Heterogeneous microstructure
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 902, Issue -, Pages 163646
Publisher
Elsevier BV
Online
2022-01-06
DOI
10.1016/j.jallcom.2022.163646
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