Article
Engineering, Electrical & Electronic
Baorui Sun, Minghui Zhang, Junjie Li, Zhe Li, Mingli Wen, Zhi-Quan Liu
Summary: A specific Ag paste was found to achieve a highly reliable bonding joint, while another set of Ag paste with better sintering performance showed a significant reduction in bonding strength. Characterizations and a proposed bonding formation mechanism were conducted to investigate this anomalous phenomenon, offering valuable theoretical support for the further application of Ag sintering.
JOURNAL OF ELECTRONIC MATERIALS
(2023)
Article
Materials Science, Multidisciplinary
Ju-Won Park, Howook Choi, Hwangsun Kim, Simoon Sung, Hye-Jin Jeong, Il Kim, Jaeseok Gong, Sung-Tae Hong, Heung Nam Han
Summary: The effect of high electric current density on the sintering of Ag wires manufactured by screen printing was evaluated in this study. It was found that applying a pulse form of high density current can reduce resistivity more effectively and enhance crystal connections within a shorter processing time. Additionally, temperature changes of Ag wire and substrate were calculated based on resistivity changes, confirming the reliability of the results.
METALS AND MATERIALS INTERNATIONAL
(2021)
Article
Chemistry, Physical
Yulei Yuan, Houya Wu, Junjie Li, Pengli Zhu, Rong Sun
Summary: This paper introduces a new type of self-reducible Cu nanoparticle paste, which achieves reliable Cu-Cu joints under different temperature and time conditions at high temperatures. The proposed MOD assisted self-reduction and sintering mechanism provides effective theoretical support for the practical application of Cu-Cu bonding.
APPLIED SURFACE SCIENCE
(2021)
Article
Nanoscience & Nanotechnology
Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma
Summary: The Ag flake formed paste demonstrates high shear strength sinter-joining on bare Si, SiC, and GaN surfaces, due to its excellent sinter-joining ability and tight adhesion. The mechanical milling-acquired flakes can be rapidly sintered into a porous structure under low-temperature conditions, with drastic morphology reconstruction during sintering introducing robust interfacial connection structures. This promising sinter-joining material is suitable for high temperature applications involving the connection of bare surfaces.
SCRIPTA MATERIALIA
(2021)
Article
Chemistry, Multidisciplinary
Tomoki Matsuda, Rei Kawabata, Takuya Okamoto, Akio Hirose
Summary: This paper proposes a method for in situ sinter bonding of Ag microparticle pastes to a Si substrate through the temporal formation and decomposition of Ag carboxylate on the surface of Ag microparticles, achieved by investigating the redox reaction between Ag2O and ethylene glycol. The thermal analysis was used to identify the product of the redox reaction and determine the bonding temperature. The in situ formation and decomposition of Ag salts, such as Ag oxalate, enables enhanced localized sinter bonding with the substrate and has potential for improving sintered bonds in electronic devices.
Article
Engineering, Electrical & Electronic
Zhongyang Deng, Guisheng Zou, Rongbao Du, Qiang Jia, Hongqiang Zhang, Lei Liu
Summary: In this study, nano-Ag films with different particle size distribution were fabricated using different pulsed laser deposition techniques. The interface bonding of the films was investigated and it was found that the films fabricated using the femtosecond laser had the smallest particle size and highest shear strength. The interface connection ratio was identified as the dominant factor affecting shear strength and fracture behaviors. The study provides new insights into interface bonding enhancement.
JOURNAL OF ELECTRONIC MATERIALS
(2023)
Article
Materials Science, Multidisciplinary
Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa
Summary: In order to meet the requirements for high-temperature die attach in terms of thermal conductivity and reliability, a novel Ag paste modified with AlN nanoparticles was developed. The thermal conductivity of the joint sintered by this modified Ag paste was tested after long-term thermal aging. It was found that the addition of 1 wt% AlN nanoparticles significantly reduced the porosity of the joint, resulting in an increase in thermal conductivity from 164.3 to 273.0 W/(K center dot m). However, excessive addition of AlN nanoparticles slightly decreased the thermal conductivity of the sintered joints. Furthermore, all joints experienced an increase in porosity and pore size during thermal aging, leading to a decrease in thermal conductivity. Nevertheless, the joint sintered with 1.0 wt% AlN nanoparticles still exhibited a high thermal conductivity of 249.4 W/(K center dot m) after 1008 hours of thermal aging, demonstrating excellent thermal conductivity and reliability.
MATERIALS CHARACTERIZATION
(2023)
Article
Materials Science, Multidisciplinary
Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa
Summary: A novel Ag paste containing chestnut-burr-like microscale Ag particles and AlN nanoparticles was developed for power module packaging materials. The joints sintered with this paste showed a high average shear strength of 54.0 MPa due to low porosity. The addition of AlN nanoparticles suppressed pore growth during thermal aging and maintained high reliability with minimal porosity increase and strength decrease. After 1008 h of aging, the joints still had an average shear strength of 36.4 MPa.
Article
Materials Science, Multidisciplinary
Seok-Hwan Chung, Jong Tae Kim, Sang Won Jeong
Summary: In this study, Cu core-Ag shell nanoparticle paste (CANP) was used to bond Cu electrodes, and the sintering conditions for CANP were developed. The electrical conductivity of the sintered CANP films at 400°C without pressure was 3.3-4.0 x 104 S/cm. Compact Cu-CANP-Cu joints could be fabricated by sintering the CANP at 350-400°C under the bonding pressure of 1.0 or 1.7 MPa. The thermal conductivity and shear strength of the CANP joints increased with sintering temperature and bonding pressure. The Cu-CANP-Cu joints had thermal conductivity up to 31.2 W/mK and shear strength up to 10.9 MPa when the CANP was sintered at 400°C under 1.7 MPa. This work provides a cost-effective and reliable sintering-bonding method for electronics packaging applications.
MATERIALS TODAY COMMUNICATIONS
(2023)
Article
Engineering, Electrical & Electronic
Wenhua Yang, Chunyan Wu, Chao Xie, Zhixiang Huang
Summary: This work proposed a Cu-Cu low temperature bonding method using mixed Cu-Ag nanoparticles paste. The oxide on the surface of Cu nanoparticles was effectively reduced and the bonding quality significantly improved after the pretreatment with formic acid vapor. Reliable Cu-Cu bonding was achieved at 250 degrees C with a low pressure of 5 MPa after formic acid vapor pretreatment, and the average shear strength reached approximately 60.5 MPa. The average resistivity of the mixed Cu-Ag nanoparticles paste after pretreatment at 250 degrees C was 39.7 mu omega.cm. The bonding interfaces became more compact and showed distinct ductile deformations with increasing bonding temperature, indicating high quality bonding.
MICROELECTRONICS RELIABILITY
(2023)
Article
Materials Science, Multidisciplinary
Wanchun Yang, Wei Zheng, Shaowei Hu, Mingyu Li
Summary: The study successfully synthesized highly antioxidant Cu@Ag particles with complete, uniform and dense Ag shells, achieving high-strength Cu-Cu joints through low-temperature sintering.
Article
Materials Science, Multidisciplinary
Sergey A. Petrov, Boris B. Bokhonov, Dina Dudina, Michail A. Korchagin, Alexander I. Gavrilov, Arina Ukhina, Olga Bakina, Marat I. Lerner
Summary: The structural features of Fe-25 wt.% Ag pseudo-alloys obtained by spark plasma sintering and ball milling were compared. The sintered pseudo-alloy from the ball-milled powder had higher microhardness and a uniform structure, while the sintered material from the WEE powder contained inclusions of different sizes and the resulting porous silver had micrometer-sized pores.
Article
Chemistry, Analytical
Hongliang Zhou, Andong Chang, Junling Fan, Jun Cao, Yingchong Zhang, Bin An, Jie Xia
Summary: Bond properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu alloy wire with a diameter of 25 μm were studied under different process parameters. The effects of electrical flaming off (EFO) current and EFO time on the deformability of the free air ball (FAB) were investigated using scanning electron microscopy (SEM), as well as the effects of ultrasonic power and bonding force on the bond characteristic. The experimental results showed that optimal shapes and sizes of FAB and mashed ball were achieved at specific EFO current, EFO time, ultrasonic power, and bonding force. These findings provide technical support for the reliability research of Pt-containing Ag-based bonding alloy wires.
Article
Chemistry, Physical
Qiang Jia, Guisheng Zou, Hongqiang Zhang, Wengan Wang, Hui Ren, Zhanwen A, Zhongyang Deng, Shaohua Yan, Daozhi Shen, Lei Liu
Summary: This study successfully prepared a new material with high shear strength and excellent resistance to silver ionic migration by utilizing Ag-Pd nanoalloy as the die attach material. The research revealed the sintering mechanism of the alloy and confirmed the high reliability of Ag-Pd nanoalloy for low temperature bonding.
APPLIED SURFACE SCIENCE
(2021)
Article
Engineering, Electrical & Electronic
Zhongyang Deng, Guisheng Zou, Hongqiang Zhang, Qiang Jia, Wengan Wang, Ying Wu, A. Zhanwen, Bin Feng, Lei Liu
Summary: Achieving high strength and reliable bonding below 150 degrees C using Ag nanoparticle pastes is still a challenge. This work developed an organic-free nano-Ag multilayer film consisting of a compact layer and a loose layer using pulsed laser deposition (PLD). The shear strength of sintered joints was strongly dependent on the diffusion behavior and microstructure evolution of loose layers. The sub-10-nanometer grains and high quantity of lattice disorders in the Ag nanoparticles induced a high diffusion driving force, ensuring high-strength bonding inside the bondline. In addition, pre-bonding and nano-bump effects of the deposited compact layer enhanced the interfacial bonding between bondline and metalized surfaces. This work provides a promising method for robust die attachment below 150 degrees C.
JOURNAL OF ELECTRONIC MATERIALS
(2023)
Article
Engineering, Manufacturing
Shiping Zhang, Ali Ghatei-Kalashami, Abdelbaset R. H. Midawi, Norman Y. Zhou
Summary: This study compared the stress-strain curves obtained through hardness-scaling and ball-indentation techniques to simulate and predict the stress/strain distribution and failure behavior of resistance spot welded joints. The results showed that both methods can accurately predict the failure location, but the ball-indentation method provides slightly better predictions of failure behavior compared to the hardness-scaling method. However, the hardness-scaling method is a simple and convenient technique, which can serve as a qualitative analysis for the failure behavior of resistance spot welded joints.
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME
(2022)
Article
Nanoscience & Nanotechnology
Shuo Zheng, Walter W. Duley, Peng Peng, Norman Zhou
Summary: This study demonstrates that nanosecond laser irradiation can significantly improve the electrical and optoelectrical properties in copper oxide nanowires, achieving joining between CuO NWs and gold electrodes and controlling the concentration and type of defects in CuO. The increase in defect centers and reduction in energy barrier at the Au/CuO interfaces lead to enhanced electrical conductivity and photo-conductivity, beneficial for applications such as resistive switching and photo-detection.
Article
Metallurgy & Metallurgical Engineering
Shadab Sarmast-Ghahfarokhi, Shiping Zhang, Abdelbaset R. H. Midawi, Frank Goodwin, Y. Norman Zhou
Summary: The influence of loading speed on the mechanical properties and failure behavior of M-Mn steel spot welds was examined. The results showed that the strength and ductility of the spot welds enhanced with increasing loading speed.
WELDING IN THE WORLD
(2022)
Article
Metallurgy & Metallurgical Engineering
C. DiGiovanni, L. He, H. Pan, N. Y. Zhou, E. Biro
Summary: This study evaluates the liquid metal embrittlement susceptibility of three material grades and two coating types during resistance spot welding and provides a new approach to assess material LME susceptibility.
WELDING IN THE WORLD
(2022)
Article
Materials Science, Multidisciplinary
Victor H. Baltazar-Hernandez, Enrique A. Lopez-Baltazar, Francisco Alvarado-Hernandez, Salvador Gomez-Jimenez, Jose Jorge Ruiz-Mondragon, Elliot Biro, Norman Zhou
Summary: A study was conducted on the post-weld microstructure, hardness profile, and uniaxial tensile behavior of a transformation-induced plasticity (TRIP) steel and a dual-phase (DP) steel that were welded using gas metal arc welding (GMAW) and laser beam welding (LBW) processes. The results showed that the LBW specimen exhibited better elongation properties and higher ultimate tensile strength (UTS) compared to the GMAW specimen. The residual stress distribution along the weldment was also analyzed, with the LBW specimen showing lower residual stresses compared to the GMAW specimen. Furthermore, the tensile residual stresses in both welding processes did not affect the overall tensile properties of the weldments.
Article
Engineering, Manufacturing
M. Shehryar Khan, Sarim Ali, Daniel Westerbaan, Walter Duley, Elliot Biro, Y. Norman Zhou
Summary: This study explores the optimization of high-speed laser welding of thin-gauge automotive steels by changing the laser impingement angle during open-keyhole mode welding. The findings show that by optimizing the laser impingement angle, the melt pool geometry can be effectively controlled, eliminating surface defects in the welds. These findings are of major relevance to industries using fiber laser systems in welding and additive manufacturing applications.
JOURNAL OF MANUFACTURING PROCESSES
(2022)
Article
Chemistry, Analytical
Ahmet Gulsaran, Bersu Bastug Azer, Samed Kocer, Sasan Rahmanian, Resul Saritas, Eihab M. Abdel-Rahman, Mustafa Yavuz
Summary: The proposed built-in packaging method offers a simplified and noise-free alternative for single terminal devices, demonstrated through an actuator application with comparable performance to conventional wire bonding. This compact and cost-effective packaging solution has potential for both industrial and academic applications.
Article
Engineering, Mechanical
Amr Kamel, Samed Kocer, Lyazzat Mukhangaliyeva, Resul Saritas, Ahmet Gulsaran, Alaa Elhady, Mohamed Basha, Parsin Hajireza, Mustafa Yavuz, Eihab Abdel-Rahman
Summary: A novel MEMS continuous deformable mirror is proposed for compensating aberrations in optical systems. It utilizes resonant electrostatic actuation to achieve low- and high-order Zernike modes with a single drive signal. The mirror has only 49 electrodes, eliminating the need for spatial control algorithms and associated hardware.
Article
Materials Science, Multidisciplinary
M. Shehryar Khan, Y-H Cho, S. Zhang, F. Goodwin, E. Biro, Y. N. Zhou
Summary: Advanced high-strength steels (AHSSs) are difficult to join using fusion welding processes. Weld-brazing offers a solution with lower heat input and reduced welding defects. This study shows that weld-brazed joints can be used for load-bearing applications with the right type of Zn-coated steel and proper joint geometry. The type of Zn coating and root geometry are the main factors influencing joint strength and fracture mode.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
(2023)
Article
Biochemical Research Methods
Lyazzat Mukhangaliyeva, Samed Kocer, Alkris Warren, Kevan Bell, Marian Boktor, Mustafa Yavuz, Eihab Abdel-Rahman, Parsin Haji Reza
Summary: This study presents a technique that optically shifts the focal plane for depth scanning of delicate biological structures and processes. The system utilizes a deformable mirror-based photoacoustic remote sensing microscopy (PARS) with a focus shifting capability. The system's effectiveness was demonstrated with resolution targets and in vivo visualizations of blood vessels.
BIOMEDICAL OPTICS EXPRESS
(2022)
Review
Chemistry, Physical
Ayman Negm, Matiar M. R. Howlader, Ilya Belyakov, Mohamed Bakr, Shirook Ali, Mehrdad Irannejad, Mustafa Yavuz
Summary: This review explores the potential of plasmonic materials in the field of biosensors. It discusses the physical aspects of plasmonic interactions, highlights mainstream and future plasmonic materials, and describes the substrates used in building plasmonic biosensors. The study identifies the role of 2D materials in enhancing sensor sensitivity and proposes titanium nitride as a promising alternative to gold. It also emphasizes the emerging role of polymer substrates in the design of wearable and point-of-care devices.
Article
Materials Science, Multidisciplinary
M. Shehryar Khan, A. Ghatei-Kalashami, X. Wang, E. Biro, Y. Norman Zhou
Summary: This study provides a comprehensive investigation into the effect of Ni on the morphology, crystallography, microstructural refinement, internal transformational strain, and mechanical properties of lath martensite. The results show that alloying lath martensitic steels with Ni can effectively refine the hierarchical microstructure and improve the mechanical properties.
JOURNAL OF MATERIALS SCIENCE
(2022)
Article
Chemistry, Multidisciplinary
Ozan Atan, Joao M. Pina, Darshan H. Parmar, Pan Xia, Yangning Zhang, Ahmet Gulsaran, Eui Dae Jung, Dongsun Choi, Muhammad Imran, Mustafa Yavuz, Sjoerd Hoogland, Edward H. Sargent
Summary: Solution-processed colloidal quantum dots (CQDs) are promising materials for short-wavelength infrared (SWIR) photodetectors. However, the low carrier mobility of CQD-based hole transport layers (HTL) limits the photodiode response speed. By employing NiOx as the HTL in inverted SWIR photodetectors, we achieve 4x shorter fall times compared to CQDs treated with 1,2-ethanedithiol (EDT). Optoelectronic simulations show that the high carrier mobility of NiOx enhances the electric field in the active layer, reducing transport time and increasing photodetector response time.
Article
Chemistry, Multidisciplinary
Yongchao Yu, Pooran Joshi, Denzel Bridges, David Fieser, Anming Hu
Summary: This paper reports multileveled resistance states of tellurium (Te) nanotube based on the clean-room free femtosecond laser nano-joining method, providing a new approach for fabricating high-quality and stable memristors.
Review
Materials Science, Multidisciplinary
Denzel Bridges, David Fieser, Jannira J. J. Santiago, Anming Hu
Summary: It is believed that high-entropy alloys (HEAs) have great potential in cryogenic and aerospace applications. However, there is still much to be explored due to the vast design space available for HEAs. This review focuses on four less addressed areas of HEA applications, including joining technologies, HEA nanomaterial synthesis, catalysis, and marine applications. The performance of HEAs as filler metals and base metals in welding and brazing is discussed, along with various methods for synthesizing HEA nanomaterials and their applications in catalysis and energy storage. Furthermore, the corrosion resistance and antifouling properties of HEAs make them intriguing materials for marine applications.
