Cutting characteristics of monocrystalline silicon in elliptical vibration nano-cutting using molecular dynamics method
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Title
Cutting characteristics of monocrystalline silicon in elliptical vibration nano-cutting using molecular dynamics method
Authors
Keywords
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Journal
COMPUTATIONAL MATERIALS SCIENCE
Volume 212, Issue -, Pages 111589
Publisher
Elsevier BV
Online
2022-06-25
DOI
10.1016/j.commatsci.2022.111589
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- (2021) Dinh-Quan Doan et al. INTERMETALLICS
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- (2019) Zhanwen Sun et al. Journal of Manufacturing Processes
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- Effect of relative tool sharpness on subsurface damage and material recovery in nanometric cutting of mono-crystalline silicon: A molecular dynamics approach
- (2019) Seyed Nader Ameli Kalkhoran et al. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
- Influence of laser nanostructured diamond tools on the cutting behavior of silicon by molecular dynamics simulation
- (2017) Houfu Dai et al. RSC Advances
- Insights into the thermo-mechanics of orthogonal nanometric machining
- (2013) P.A. Romero et al. COMPUTATIONAL MATERIALS SCIENCE
- Comparison of tool–chip stress distributions in nano-machining of monocrystalline silicon and copper
- (2013) Chunhui Ji et al. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
- Effect of crystal plane orientation on the friction-induced nanofabrication on monocrystalline silicon
- (2013) Bingjun Yu et al. Nanoscale Research Letters
- A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
- (2012) Muhammad Arif et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Wear mechanism of diamond tools against single crystal silicon in single point diamond turning process
- (2012) Saurav Goel et al. TRIBOLOGY INTERNATIONAL
- Molecular dynamics simulation model for the quantitative assessment of tool wear during single point diamond turning of cubic silicon carbide
- (2011) Saurav Goel et al. COMPUTATIONAL MATERIALS SCIENCE
- A new two-dimensional ultrasonic assisted grinding (2D-UAG) method and its fundamental performance in monocrystal silicon machining
- (2010) Zhiqiang Liang et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Nanoscratch-induced phase transformation of monocrystalline Si
- (2010) Y.Q. Wu et al. SCRIPTA MATERIALIA
- Material removal mechanisms of monocrystalline silicon under the impact of high velocity micro-particles
- (2010) A.K. Basak et al. WEAR
- Friction-induced hillocks on monocrystalline silicon in atmosphere and in vacuum
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