Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Published 2011 View Full Article

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Title
Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint
Authors
Keywords
-
Journal
MATERIALS TRANSACTIONS
Volume 52, Issue 8, Pages 1553-1559
Publisher
Japan Institute of Metals
Online
2011-07-25
DOI
10.2320/matertrans.m2011107

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