In situ observations on shear and creep–fatigue fracture behaviors of SnBi/Cu solder joints

Published 2010 View Full Article

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Title
In situ observations on shear and creep–fatigue fracture behaviors of SnBi/Cu solder joints
Authors
Keywords
-
Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 528, Issue 6, Pages 2686-2693
Publisher
Elsevier BV
Online
2010-12-17
DOI
10.1016/j.msea.2010.12.041

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