Vacuum diffusion bonding of TC4 titanium alloy and T2 copper by a slow cooling heat treatment
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Title
Vacuum diffusion bonding of TC4 titanium alloy and T2 copper by a slow cooling heat treatment
Authors
Keywords
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Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 305, Issue -, Pages 117595
Publisher
Elsevier BV
Online
2022-04-07
DOI
10.1016/j.jmatprotec.2022.117595
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