Interfacial microstructure and mechanical properties of diffusion bonded TC4/0Cr18Ni9/Oxygen Free Copper joints

Title
Interfacial microstructure and mechanical properties of diffusion bonded TC4/0Cr18Ni9/Oxygen Free Copper joints
Authors
Keywords
-
Journal
MATERIALS & DESIGN
Volume 50, Issue -, Pages 230-234
Publisher
Elsevier BV
Online
2013-02-28
DOI
10.1016/j.matdes.2013.01.042

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