Vacuum diffusion bonding of TC4 titanium alloy and T2 copper by a slow cooling heat treatment
出版年份 2022 全文链接
标题
Vacuum diffusion bonding of TC4 titanium alloy and T2 copper by a slow cooling heat treatment
作者
关键词
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出版物
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 305, Issue -, Pages 117595
出版商
Elsevier BV
发表日期
2022-04-07
DOI
10.1016/j.jmatprotec.2022.117595
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