Optimisation of Thiourea Concentration in a Decorative Copper Plating Acid Bath Based on Methanesulfonic Electrolyte

Title
Optimisation of Thiourea Concentration in a Decorative Copper Plating Acid Bath Based on Methanesulfonic Electrolyte
Authors
Keywords
-
Journal
Coatings
Volume 12, Issue 3, Pages 376
Publisher
MDPI AG
Online
2022-03-14
DOI
10.3390/coatings12030376

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