The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation

Published 2007 View Full Article

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Title
The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation
Authors
Keywords
-
Journal
THIN SOLID FILMS
Volume 516, Issue 12, Pages 3761-3766
Publisher
Elsevier BV
Online
2007-06-16
DOI
10.1016/j.tsf.2007.06.069

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