Heterogeneous microstructure enables a synergy of strength, ductility and electrical conductivity in copper alloys

Enhanced mechanical properties and thermal conductivity of W-30Cu composite fabricated with monodisperse and nearly spherical W powder

(2021) Zheng Chen et al.   INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS

Perspective on hetero-deformation induced (HDI) hardening and back stress

(2019) Yuntian Zhu et al.   Materials Research Letters

Extra strengthening in a coarse/ultrafine grained laminate: Role of gradient interfaces

(2019) Y.F. Wang et al.   INTERNATIONAL JOURNAL OF PLASTICITY

The roles of Hf element in optimizing strength, ductility and electrical conductivity of copper alloys

(2019) Rengeng Li et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Microstructural, mechanical and tribological properties of ultrafine-grained Cu–Cr–Zr alloy processed by high pressure torsion

(2019) G. Purcek et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A multiscale architectured CuCrZr alloy with high strength, electrical conductivity and thermal stability

(2018) Ningning Liang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A high strength and high electrical conductivity Cu-Cr-Zr alloy fabricated by cryorolling and intermediate aging treatment

(2017) Shaojian Zhang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Mechanical properties of copper/bronze laminates: Role of interfaces

(2016) Xiaolong Ma et al.   ACTA MATERIALIA

Biaxial deformation behavior and formability of precipitation hardened ultra-fine grained (UFG) Cu–Cr–Zr alloy

(2016) Onur Saray   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Three-dimensionally gradient harmonic structure design: an integrated approach for high performance structural materials

(2016) Sanjay Kumar Vajpai et al.   Materials Research Letters

Back stress strengthening and strain hardening in gradient structure

(2016) Muxin Yang et al.   Materials Research Letters

Deformation microstructures, strengthening mechanisms, and electrical conductivity in a Cu–Cr–Zr alloy

(2015) R. Mishnev et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Heterogeneous lamella structure unites ultrafine-grain strength with coarse-grain ductility

(2015) Xiaolei Wu et al.   PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA

A high strength and high electrical conductivity bulk CuCrZr alloy with nanotwins

(2015) L.X. Sun et al.   SCRIPTA MATERIALIA

Synergetic Strengthening by Gradient Structure

(2014) X. L. Wu et al.   Materials Research Letters

Evolution of dislocation density distributions in copper during tensile deformation

(2013) J. Jiang et al.   ACTA MATERIALIA

The effects of equal channel angular extrusion on the mechanical and electrical properties of alumina dispersion-strengthened copper alloys

(2012) R.F. Need et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Revealing Extraordinary Intrinsic Tensile Plasticity in Gradient Nano-Grained Copper

(2011) T. H. Fang et al.   SCIENCE

3D-AP and positron annihilation study of precipitation behavior in Cu–Cr–Zr alloy

(2009) M. Hatakeyama et al.   JOURNAL OF NUCLEAR MATERIALS