A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters
出版年份 2021 全文链接
标题
A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters
作者
关键词
Grit cutting depth, Analytic model, Grit deflection, Surface roughness, Brittle and hard materials
出版物
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Volume 72, Issue -, Pages 461-468
出版商
Elsevier BV
发表日期
2021-06-23
DOI
10.1016/j.precisioneng.2021.06.007
参考文献
相关参考文献
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