Thermo-mechanical modeling of stacked die flash memory package EMI shielding layer crack under thermal cycling test

Published 2021 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Thermo-mechanical modeling of stacked die flash memory package EMI shielding layer crack under thermal cycling test
Authors
Keywords
EMI, Stacked die, FEA, TCT, Crack, Stress concentration
Journal
MICROELECTRONICS RELIABILITY
Volume 127, Issue -, Pages 114410
Publisher
Elsevier BV
Online
2021-10-27
DOI
10.1016/j.microrel.2021.114410
References
View 3 related references

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.