Thermo-mechanical modeling of stacked die flash memory package EMI shielding layer crack under thermal cycling test

标题
Thermo-mechanical modeling of stacked die flash memory package EMI shielding layer crack under thermal cycling test
作者
关键词
EMI, Stacked die, FEA, TCT, Crack, Stress concentration
出版物
MICROELECTRONICS RELIABILITY
Volume 127, Issue -, Pages 114410
出版商
Elsevier BV
发表日期
2021-10-27
DOI
10.1016/j.microrel.2021.114410

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