Electrodeposition current density induced texture and grain boundary engineering in Sn coatings for enhanced corrosion resistance

Study on corrosion behavior of β-Sn and intermetallic compounds phases in SAC305 alloy by in-situ EC-AFM and first-principles calculation

(2021) Pan Yi et al.   CORROSION SCIENCE

Tin whiskers prefer to grow from the [001] grains in a tin coating on aluminum substrate

(2021) Shuang Tian et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds

(2018) Z.L. Ma et al.   ACTA MATERIALIA

Correlating the five parameter grain boundary character distribution and the intergranular corrosion behaviour of a stainless steel using 3D orientation microscopy based on mechanical polishing serial sectioning

(2018) D. An et al.   ACTA MATERIALIA

Corrosion resistant nickel coating with strong adhesion on AZ31B magnesium alloy prepared by an in-situ shot-peening-assisted cold spray

(2018) Ying-Kang Wei et al.   CORROSION SCIENCE

Corrosion behavior of Sn-3.0Ag-0.5Cu alloy under chlorine-containing thin electrolyte layers

(2018) Bokai Liao et al.   CORROSION SCIENCE

Synergistic effects of cavitation erosion and corrosion for nickel aluminium bronze with oxide film in 3.5% NaCl solution

(2017) J. Basumatary et al.   WEAR

Iterative thermomechanical processing of alloy 600 for improved resistance to corrosion and stress corrosion cracking

(2016) Abhishek Telang et al.   ACTA MATERIALIA

The role of Zn precipitates and Cl− anions in pitting corrosion of Sn–Zn solder alloys

(2015) Jian-Chun Liu et al.   CORROSION SCIENCE

Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers

(2015) Piyush Jagtap et al.   JOURNAL OF ELECTRONIC MATERIALS

The effect of electroplating parameters and substrate material on tin whisker formation

(2015) M.A. Ashworth et al.   MICROELECTRONICS RELIABILITY

The surface energies of β -Sn — A new concept for corrosion and whisker mitigation

(2015) P. Eckold et al.   MICROELECTRONICS RELIABILITY

Electrophoretic deposition of graphene oxide on mild carbon steel for anti-corrosion application

(2014) Ji Hoon Park et al.   SURFACE & COATINGS TECHNOLOGY

Green approach to fabrication of a super-hydrophobic film on copper and the consequent corrosion resistance

(2013) Peng Wang et al.   CORROSION SCIENCE

Grain Boundary Character Distribution of Nanocrystalline Cu Thin Films Using Stereological Analysis of Transmission Electron Microscope Orientation Maps

(2013) A.D. Darbal et al.   MICROSCOPY AND MICROANALYSIS

Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

(2012) Mingna Wang et al.   CORROSION SCIENCE

The corrosion of tin under thin electrolyte layers containing chloride

(2012) Xiankang Zhong et al.   CORROSION SCIENCE

Effect of additive and current density on microstructure and texture characteristics of copper electrodeposits

(2012) R. Manu et al.   International Journal of Materials Research

The Distribution of Grain Boundary Planes in Interstitial Free Steel

(2012) Hossein Beladi et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Cyclic twin nucleation in tin-based solder alloys

(2010) L.P. Lehman et al.   ACTA MATERIALIA

Atomistic modeling of β-Sn surface energies and adatom diffusivity

(2010) Michael S. Sellers et al.   APPLIED SURFACE SCIENCE

Intergranular Corrosion Resistance of Σ3 Grain Boundaries in Alloy 22

(2010) P. Jakupi et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Kinetics of Sn electrodeposition from Sn(II)–citrate solutions

(2008) Chunfen Han et al.   ELECTROCHIMICA ACTA

Effect of the Current Density on Morphology, Porosity, and Tribological Properties of Electrodeposited Nickel on Copper

(2008) Vanessa F.C. Lins et al.   JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

Electrochemical characteristics of Sn film prepared by pulse electrodeposition method as negative electrode for lithium secondary batteries

(2008) Koichi Ui et al.   JOURNAL OF POWER SOURCES