Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics
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Title
Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics
Authors
Keywords
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Journal
Advanced Materials Technologies
Volume 6, Issue 9, Pages 2100280
Publisher
Wiley
Online
2021-06-28
DOI
10.1002/admt.202100280
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