Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics

Title
Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics
Authors
Keywords
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Journal
Advanced Materials Technologies
Volume 6, Issue 9, Pages 2100280
Publisher
Wiley
Online
2021-06-28
DOI
10.1002/admt.202100280

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