Numerical investigation on subsurface damage in nanometric cutting of single-crystal silicon at elevated temperatures

Molecular dynamics simulation of AFM tip-based hot scratching of nanocrystalline GaAs

(2021) Pengfei Fan et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Subsurface damage and phase transformation in laser-assisted nanometric cutting of single crystal silicon

(2020) Xiao Chen et al.   MATERIALS & DESIGN

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

(2020) Liang Zhao et al.   CERAMICS INTERNATIONAL

Laser recovery of grinding-induced subsurface damage in the edge and notch of a single-crystal silicon wafer

(2019) Keiichiro Niitsu et al.   Surface Topography-Metrology and Properties

Effect of tool edge radius on material removal mechanism of single-crystal silicon: Numerical and experimental study

(2019) Bing Liu et al.   COMPUTATIONAL MATERIALS SCIENCE

Numerical study of three-body diamond abrasive polishing single crystal Si under graphene lubrication by molecular dynamics simulation

(2019) Houfu Dai et al.   COMPUTATIONAL MATERIALS SCIENCE

Disturbance and recovery in high speed (110) cleavage in single crystalline silicon

(2018) Lv Zhao et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Process parameter effects on residual stress and phase purity after microlaser-assisted machining of silicon

(2018) Sean McCoy Langan et al.   MATERIALS AND MANUFACTURING PROCESSES

Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation

(2018) Houfu Dai et al.   NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS

Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation

(2018) Binbin Meng et al.   INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

Diamond cutting of micro-structure array on brittle material assisted by multi-ion implantation

(2018) Jinshi Wang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

High temperature nanoscratching of single crystal silicon under reduced oxygen condition

(2017) Saeed Zare Chavoshi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Nanometric Cutting of Silicon with an Amorphous-Crystalline Layered Structure: A Molecular Dynamics Study

(2017) Jinshi Wang et al.   Nanoscale Research Letters

Anisotropy of Single-Crystal Silicon in Nanometric Cutting

(2017) Zhiguo Wang et al.   Nanoscale Research Letters

Nanometric Cutting of Silicon with an Amorphous-Crystalline Layered Structure: A Molecular Dynamics Study

(2017) Jinshi Wang et al.   Nanoscale Research Letters

Anisotropy of Single-Crystal Silicon in Nanometric Cutting

(2017) Zhiguo Wang et al.   Nanoscale Research Letters

Sculpturing of single crystal silicon microstructures by elliptical vibration cutting

(2017) Jianguo Zhang et al.   Journal of Manufacturing Processes

Influence of microstructure on the cutting behaviour of silicon

(2016) Saurav Goel et al.   ACTA MATERIALIA

An atomistic simulation investigation on chip related phenomena in nanometric cutting of single crystal silicon at elevated temperatures

(2016) Saeed Zare Chavoshi et al.   COMPUTATIONAL MATERIALS SCIENCE

Global transition path search for dislocation formation in Ge on Si(001)

(2016) E. Maras et al.   COMPUTER PHYSICS COMMUNICATIONS

Molecular dynamics simulation study of deformation mechanisms in 3C–SiC during nanometric cutting at elevated temperatures

(2016) Saeed Zare Chavoshi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon

(2016) Xiaoguang Guo et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Influence of temperature on the anisotropic cutting behaviour of single crystal silicon: A molecular dynamics simulation investigation

(2016) Saeed Zare Chavoshi et al.   Journal of Manufacturing Processes

Molecular dynamics modelling of brittle–ductile cutting mode transition: Case study on silicon carbide

(2015) Gaobo Xiao et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Diamond machining of silicon: A review of advances in molecular dynamics simulation

(2015) Saurav Goel et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Ductile cutting of silicon microstructures with surface inclination measurement and compensation by using a force sensor integrated single point diamond tool

(2015) Yuan-Liu Chen et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

The mechanical properties of the scratched surface for silica glass by molecular dynamics simulation

(2015) Xiaoguang Guo et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Experimental work on micro laser-assisted diamond turning of silicon (111)

(2015) Hossein Mohammadi et al.   Journal of Manufacturing Processes

Laser recovery of machining damage under curved silicon surface

(2013) Jiwang Yan et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Crystallographic effect on subsurface damage formation in silicon microcutting

(2012) Jiwang Yan et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Improvement of machinability of Waspaloy via laser-assisted machining

(2012) Hongtao Ding et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Ductile mode material removal and high-pressure phase transformation in silicon during micro-laser assisted machining

(2012) Deepak Ravindra et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

A study on phase transformation of monocrystalline silicon due to ultra-precision polishing by molecular dynamics simulation

(2012) Lin Zhang et al.   AIP Advances

Nucleation of Si and Ge by rapid cooling using molecular-dynamics simulation

(2011) Yanping Xiao et al.   JOURNAL OF CRYSTAL GROWTH

Characteristics of laser assisted machining for silicon nitride ceramic according to machining parameters

(2011) Jong-Do Kim et al.   Journal of Mechanical Science and Technology

Phase stability of silicon during indentation at elevated temperature: evidence for a direct transformation from metallic Si-II to diamond cubic Si-I

(2011) S.K. Bhuyan et al.   MRS Communications

Thermally enhanced machining of hard-to-machine materials—A review

(2010) S. Sun et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Extracting dislocations and non-dislocation crystal defects from atomistic simulation data

(2010) Alexander Stukowski et al.   MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING

Nanoindentation-induced phase transformations in silicon at elevated temperatures

(2009) S Ruffell et al.   NANOTECHNOLOGY

XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer

(2008) W.J. Zong et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Effects of workpiece preheating on surface roughness, chatter and tool performance during end milling of hardened steel D2

(2008) A.K.M. Nurul Amin et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

An experimental investigation of hot-machining to predict tool life

(2007) K.P. Maity et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY