Engineering Tough Metallosupramolecular Hydrogel Films with Kirigami Structures for Compliant Soft Electronics

Title
Engineering Tough Metallosupramolecular Hydrogel Films with Kirigami Structures for Compliant Soft Electronics
Authors
Keywords
-
Journal
Small
Volume -, Issue -, Pages 2103836
Publisher
Wiley
Online
2021-09-13
DOI
10.1002/smll.202103836

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