Quantitative mechanisms behind the synchronous increase of strength and electrical conductivity of cold-drawing oxygen-free Cu wires

Microstructural characterization of cold-drawn Cu–Ni–Si alloy having high strength and high conductivity

(2020) Hwangsun Kim et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Two-stage Hall-Petch relationship in Cu with recrystallized structure

(2020) Y.Z. Tian et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Alloy design strategies to increase strength and its trade-offs together

(2020) Seung Zeon Han et al.   PROGRESS IN MATERIALS SCIENCE

Optimizing the strength, ductility and electrical conductivity of a Cu-Cr-Zr alloy by rotary swaging and aging treatment

(2019) A.H. Huang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

A high strength and high electrical conductivity Cu-Cr-Zr alloy fabricated by cryogenic friction stir processing and subsequent annealing treatment

(2019) Yunpeng Wang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of High‐Pressure Torsion on Hardness and Electrical Resistivity of Commercially Pure Cu

(2019) Ajay Rijal et al.   ADVANCED ENGINEERING MATERIALS

Hall–Petch Relations of Severely Deformed Cu, Ni, and Cu–Ni Alloys: Analysis of the Dislocation Blockage Strength of Deformation‐Modified Grain Boundaries

(2019) Friederike Emeis et al.   ADVANCED ENGINEERING MATERIALS

Surface strengthening behaviors of pure Cu with heterogeneous microstructures

(2018) C.X. Ren et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Breaking the trade-off relation of strength and electrical conductivity in pure Al wire by controlling texture and grain boundary

(2018) J.P. Hou et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Three principles for preparing Al wire with high strength and high electrical conductivity

(2018) J.P. Hou et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Microstructure and mechanical properties of a high strength Cu-Ni-Si alloy treated by combined aging processes

(2017) Qian Lei et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of chromium and zirconium content on structure, strength and electrical conductivity of Cu-Cr-Zr alloys after high pressure torsion

(2017) D.V. Shangina et al.   MATERIALS LETTERS

Six decades of the Hall–Petch effect – a survey of grain-size strengthening studies on pure metals

(2016) Z. C. Cordero et al.   INTERNATIONAL MATERIALS REVIEWS

Optimization of strength, ductility and electrical conductivity of Cu–Cr–Zr alloy by combining multi-route ECAP and aging

(2016) G. Purcek et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains

(2016) Gongcheng Yao et al.   Metals

Microstructural design of new high conductivity – high strength Cu-based alloy

(2015) S. Gorsse et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Dislocation density of pure copper processed by accumulative roll bonding and equal-channel angular pressing

(2015) Yoji Miyajima et al.   MATERIALS CHARACTERIZATION

Effect of ECAP combined cold working on mechanical properties and electrical conductivity of Conform-produced Cu–Mg alloys

(2013) Chengcheng Zhu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Additivity of strengthening mechanisms in ultrafine grained Al–Mg–Sc alloy

(2013) N. Kumar et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Predicting grain refinement by cold severe plastic deformation in alloys using volume averaged dislocation generation

(2009) Marco J. Starink et al.   ACTA MATERIALIA

Grain boundary effects on cyclic deformation and fatigue damage

(2008) Z.F. Zhang et al.   PROGRESS IN MATERIALS SCIENCE