Microstructural characterization of cold-drawn Cu–Ni–Si alloy having high strength and high conductivity

Published 2020 View Full Article

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Title
Microstructural characterization of cold-drawn Cu–Ni–Si alloy having high strength and high conductivity
Authors
Keywords
Nanostructured materials, Intermetallics, Microstructure, Transmission electron microscopy, Cu alloy
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 832, Issue -, Pages 155059
Publisher
Elsevier BV
Online
2020-04-07
DOI
10.1016/j.jallcom.2020.155059

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