Introducing a novel heat sink comprising PCM and air - Adapted to electronic device thermal management
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Title
Introducing a novel heat sink comprising PCM and air - Adapted to electronic device thermal management
Authors
Keywords
PCM-based heat sink, Hybrid heat sink, Electronic device, Cooling
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 169, Issue -, Pages 120914
Publisher
Elsevier BV
Online
2021-01-19
DOI
10.1016/j.ijheatmasstransfer.2021.120914
References
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