Thermal management of electronic devices using pin-fin based cascade microencapsulated PCM/expanded graphite composite

Title
Thermal management of electronic devices using pin-fin based cascade microencapsulated PCM/expanded graphite composite
Authors
Keywords
-
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 149, Issue -, Pages 119199
Publisher
Elsevier BV
Online
2020-01-15
DOI
10.1016/j.ijheatmasstransfer.2019.119199

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