Introducing a novel heat sink comprising PCM and air - Adapted to electronic device thermal management
出版年份 2021 全文链接
标题
Introducing a novel heat sink comprising PCM and air - Adapted to electronic device thermal management
作者
关键词
PCM-based heat sink, Hybrid heat sink, Electronic device, Cooling
出版物
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 169, Issue -, Pages 120914
出版商
Elsevier BV
发表日期
2021-01-19
DOI
10.1016/j.ijheatmasstransfer.2021.120914
参考文献
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