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Title
A Review of Heat Pipe technology for Foldable Electronic Devices
Authors
Keywords
Electronic cooling, Flexible heat pipe, Thermal ground plane, Thermal spreader, Vapor chamber, Thermal management
Journal
APPLIED THERMAL ENGINEERING
Volume -, Issue -, Pages 117087
Publisher
Elsevier BV
Online
2021-05-14
DOI
10.1016/j.applthermaleng.2021.117087
References
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