A novel flat polymer heat pipe with thermal via for cooling electronic devices

Published 2015 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
A novel flat polymer heat pipe with thermal via for cooling electronic devices
Authors
Keywords
Polymer heat pipe, Filling ratio, Thermal resistance, Vapor chamber, Thermal via, Electronics cooling
Journal
ENERGY CONVERSION AND MANAGEMENT
Volume 100, Issue -, Pages 37-44
Publisher
Elsevier BV
Online
2015-05-15
DOI
10.1016/j.enconman.2015.04.063

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.