A novel flat polymer heat pipe with thermal via for cooling electronic devices

Published 2015 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
A novel flat polymer heat pipe with thermal via for cooling electronic devices
Authors
Keywords
Polymer heat pipe, Filling ratio, Thermal resistance, Vapor chamber, Thermal via, Electronics cooling
Journal
ENERGY CONVERSION AND MANAGEMENT
Volume 100, Issue -, Pages 37-44
Publisher
Elsevier BV
Online
2015-05-15
DOI
10.1016/j.enconman.2015.04.063

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.