Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices

Published 2019 View Full Article

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Title
Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices
Authors
Keywords
Ultra-thin vapour chamber, Vapour-liquid channel separation, Mesh wick, Cooling module, Thermal performance, Heat dissipation
Journal
ENERGY CONVERSION AND MANAGEMENT
Volume 187, Issue -, Pages 221-231
Publisher
Elsevier BV
Online
2019-03-20
DOI
10.1016/j.enconman.2019.03.038

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