Cuboidal γ' phase coherent precipitation-strengthened Cu–Ni–Al alloys with high softening temperature
Published 2020 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Cuboidal γ' phase coherent precipitation-strengthened Cu–Ni–Al alloys with high softening temperature
Authors
Keywords
Cu–Ni–Al alloys, coherent precipitation, mechanical properties, conductivity, thermal stability
Journal
ACTA MATERIALIA
Volume 203, Issue -, Pages 116458
Publisher
Elsevier BV
Online
2020-11-09
DOI
10.1016/j.actamat.2020.10.076
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Effects of Mg addition on the microstructure and softening resistance of Cu–Cr alloys
- (2020) Yuqing Sun et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Optimization of strength and ductility in an as-extruded Cu–15Ni–8Sn alloy by the additions of Si and Ti
- (2020) Chao Zhao et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Microstructure and properties of Cu-Cr-Nb alloy with high strength, high electrical conductivity and good softening resistance performance at elevated temperature
- (2019) Xiaoli Guo et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Strength and electrical conductivity behavior of nanoparticles reaction on new alumina dispersion-strengthened copper alloy
- (2019) Yabo Fu et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Comparative studies on microstructures and properties of Cu–Ni–M alloys controlled by strong interaction between elements
- (2019) Z.M. Li et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Load-dependent tribocorrosion behaviour of nickel-aluminium bronze in artificial seawater
- (2018) Beibei Zhang et al. CORROSION SCIENCE
- Enhanced thermal stability of Cu alloy films by strong interaction between Ni and Zr (or Fe)
- (2018) Yuehong Zheng et al. JOURNAL OF PHYSICS D-APPLIED PHYSICS
- Quantitative Correlation between Electrical Resistivity and Microhardness of Cu-Ni-Mo Alloys via a Short-Range Order Cluster Model
- (2018) Hongming Li et al. JOURNAL OF ELECTRONIC MATERIALS
- Effects of annealing on microstructure and mechanical properties of rapidly solidified Cu-3 wt% Ag-1 wt% Zr
- (2018) Xiang Wu et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Multicomponent intermetallic nanoparticles and superb mechanical behaviors of complex alloys
- (2018) T. Yang et al. SCIENCE
- A high strength and high electrical conductivity Cu-Cr-Zr alloy fabricated by cryorolling and intermediate aging treatment
- (2017) Shaojian Zhang et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- The effect of heat treatment on precipitation in the Cu-Ni-Al alloy Hiduron® 130
- (2017) Katerina A. Christofidou et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- A promising structure for fabricating high strength and high electrical conductivity copper alloys
- (2016) Rengeng Li et al. Scientific Reports
- High entropy brasses and bronzes – Microstructure, phase evolution and properties
- (2015) Kevin J. Laws et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Electrical resistivity interpretation of ternary Cu–Ni–Mo alloys using a cluster-based short-range-order structural model
- (2015) Hongming Li et al. JOURNAL OF PHYSICS D-APPLIED PHYSICS
- Dry wear behavior of ultra-high strength Cu–10Ni–3Al–0.8Si alloy
- (2015) Leinuo Shen et al. TRIBOLOGY INTERNATIONAL
- Effects of silicon and thermo-mechanical process on microstructure and properties of Cu–10Ni–3Al–0.8Si alloy
- (2014) Leinuo Shen et al. MATERIALS & DESIGN
- GSAS-II: the genesis of a modern open-source all purpose crystallography software package
- (2013) Brian H. Toby et al. JOURNAL OF APPLIED CRYSTALLOGRAPHY
- A novel approach for strengthening Cu–Y2O3 composites by in situ reaction at liquidus temperature
- (2013) Haiou Zhuo et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation
- (2012) X. N. Li et al. JOURNAL OF ELECTRONIC MATERIALS
- Thermodynamic feasibility of solid solubility extension of Nb in Cu and their thermal stability
- (2012) Suhrit Mula et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Influence of dc electric current on the hardness of thermally aged Cu–Cr–Zr alloy
- (2008) Zhiqiang Wang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Microstructure, mechanical properties, electrical conductivity and wear behavior of high volume TiC reinforced Cu-matrix composites
- (2008) Farid Akhtar et al. MATERIALS CHARACTERIZATION
Find Funding. Review Successful Grants.
Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.
ExploreCreate your own webinar
Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.
Create Now