4.6 Article

Field-Induced Ferroelectric Hf1-xZrxO2Thin Films for High-kDynamic Random Access Memory

Journal

ADVANCED ELECTRONIC MATERIALS
Volume 6, Issue 11, Pages -

Publisher

WILEY
DOI: 10.1002/aelm.202000631

Keywords

capacitive layers; dynamic random access memory; field-induced ferroelectrics; Hf1-xZrxO2; high-k dielectrics

Funding

  1. National Research Foundation of Korea [2020R1A3B2079882]
  2. Technology Innovation Program through MOTIE (Ministry of Trade, Industry, & Energy) [project name: Understanding of defect behavior in the dielectric thin film and their analysis technology development] [20003634]
  3. Korea Evaluation Institute of Industrial Technology (KEIT) [20003634] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
  4. National Research Foundation of Korea [4120200513611] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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The field-induced ferroelectric Hf1-xZrxO2(FFE-HZO) thin film is investigated for use as the capacitive layer in the future dynamic random access memory (DRAM). Although the dielectric permittivity of FFE-HZO is as high as approximate to 80, a high electric field (4 MV cm(-1)) is needed to activate the FFE mechanism and the accompanying high dielectric permittivity value. The Zr content is adjusted, or field cycling is performed, to obtain a high dielectric permittivity at a low electric-field region for feasible DRAM operation. As a result, a dielectric permittivity value of 60-80 is achieved in the low field region (0-2 MV cm(-1)), which coincided with an equivalent oxide thickness of 0.47 nm with a stable leakage current at 0.8 V. The involvement of hysteresis in the polarization-electric field curve of the film, however, caused significant energy loss (40-60%). Hysteresis engineering using various dopants, and improving the deposition process, annealing process, or passive interfacial layer, should be the next step.

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