On the factors affecting the dissolution of copper in molten lead‐free solders and development of a method to assess the soldering parameters

Published 2009 View Full Article

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Title
On the factors affecting the dissolution of copper in molten lead‐free solders and development of a method to assess the soldering parameters
Authors
Keywords
-
Journal
SOLDERING & SURFACE MOUNT TECHNOLOGY
Volume 21, Issue 4, Pages 24-31
Publisher
Emerald
Online
2009-10-06
DOI
10.1108/09540910910989402

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