Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering

Effect of intermetallic compounds on mechanical properties of copper joints ultrasonic-soldered with Sn-Zn alloy

(2017) Tianmin Luan et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Interfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering

(2017) Wei-bing GUO et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA

Novel organic-inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review

(2015) Yongcun Zhou et al.   POLYMER COMPOSITES

Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packaging

(2014) M.S. Park et al.   MICROELECTRONICS RELIABILITY

Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature

(2013) Mingyu Li et al.   APPLIED PHYSICS LETTERS

Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process

(2013) Chunjin Hang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal

(2013) Yong Xiao et al.   MATERIALS & DESIGN

Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering

(2012) Ming Yang et al.   INTERMETALLICS

Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding

(2012) H. Liu et al.   JOURNAL OF ELECTRONIC MATERIALS

The effect of high strain rate deformation on intermetallic reaction during ultrasonic welding aluminium to magnesium

(2012) A. Panteli et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Wetting and reaction promoted by ultrasound between sapphire and liquid Al–12Si alloy

(2012) Wei Cui et al.   ULTRASONICS SONOCHEMISTRY

Process robustness of single lap ultrasonic welding of thin, dissimilar materials

(2011) T.H. Kim et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump

(2011) Byung-Hyun Kwak et al.   MICROELECTRONIC ENGINEERING

Strengthening mechanism of ceramic particle reinforced bonds by ultrasonic brazing of AlMMCs

(2011) Xue-song LENG et al.   TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

(2010) J.F. Li et al.   ACTA MATERIALIA

Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

(2010) Byoung-Joon Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

(2010) T. Laurila et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

On the pressure of cavitation bubbles

(2008) E.A. Brujan et al.   EXPERIMENTAL THERMAL AND FLUID SCIENCE