Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles

Finite Element Analysis for Reliability of Solder Joints Materials in the Embedded Package

(2019) Seunghyun Cho et al.   Electronic Materials Letters

Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST)

(2018) Jeonga Kim et al.   Electronic Materials Letters

Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors

(2018) Seungjun Noh et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Characterization of novel high-speed die attachment method at 225 °C using submicrometer Ag-coated Cu particles

(2018) Chang Hyun Lee et al.   SCRIPTA MATERIALIA

Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding

(2018) Junjie Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A green approach of synthesizing of Cu-Ag core-shell nanoparticles and their sintering behavior for printed electronics

(2017) Xing Yu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Submicron Ag-coated Cu particles and characterization methods to evaluate their quality

(2016) Eun Byeol Choi et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

(2016) K. S. Siow et al.   JOURNAL OF ELECTRONIC PACKAGING

Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

(2016) Xiangdong Liu et al.   SCRIPTA MATERIALIA

Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology

(2015) Tao-Chih Chang et al.   MICROELECTRONICS RELIABILITY

Preparation and oxidation behavior of Ag-coated Cu nanoparticles less than 20 nm in size

(2014) Sang-Soo Chee et al.   Journal of Materials Chemistry C

Ag Dewetting in Cu@Ag Monodisperse Core–Shell Nanoparticles

(2012) Anya Muzikansky et al.   Journal of Physical Chemistry C

Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder

(2012) Bo-In Noh et al.   MICROELECTRONIC ENGINEERING

Preparation and Low-Temperature Sintering of Cu Nanoparticles for High-Power Devices

(2012) Shutesh Krishnan et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Preparation of PVP coated Cu NPs and the application for low-temperature bonding

(2011) Yan Jianfeng et al.   JOURNAL OF MATERIALS CHEMISTRY

A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles

(2010) Y. Morisada et al.   JOURNAL OF ELECTRONIC MATERIALS