A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging
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Title
A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 31, Issue 3, Pages 1808-1816
Publisher
Springer Science and Business Media LLC
Online
2019-12-23
DOI
10.1007/s10854-019-02697-9
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