Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems

Published 2019 View Full Article

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Title
Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems
Authors
Keywords
-
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 9, Issue 9, Pages 1815-1824
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2019-03-19
DOI
10.1109/tcpmt.2019.2905610

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