Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems

出版年份 2019 全文链接

标题

作者

关键词

出版物

Volume 9, Issue 9, Pages 1815-1824

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2019-03-19

DOI

10.1109/tcpmt.2019.2905610

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