Application of AlMgGaLi foil for joining copper to SiCp/Al-MMCs for high-temperature and high-power electronics

High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal

(2017) Biqiang Chen et al.   JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

Availability of in-situ reinforced active-transient liquid phase bond with good wettability for 70 vol.% SiCp/A356 composite using Al-Mg-Ga-Ti interlayer

(2016) Guifeng Zhang et al.   MATERIALS & DESIGN

Active-Transient Liquid Phase (A-TLP) Bonding of High Volume Fraction SiC Particle Reinforced A356 Matrix Composite

(2015) Guifeng Zhang et al.   MATERIALS TRANSACTIONS

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

(2012) Ales Kroupa et al.   JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

Review of metal matrix composites with high thermal conductivity for thermal management applications

(2012) Xuan-hui QU et al.   Progress in Natural Science-Materials International

Investigation of thermal management materials for automotive electronic control units

(2010) Sabuj Mallik et al.   APPLIED THERMAL ENGINEERING

Ultrasonic assisted fabrication of particle reinforced bonds joining aluminum metal matrix composites

(2010) Jiuchun Yan et al.   MATERIALS & DESIGN

High-temperature lead-free solders: Properties and possibilities

(2009) Katsuaki Suganuma et al.   JOM

Liquid-state and solid-state interfacial reactions of fluxless-bonded Au–20Sn/ENIG solder joint

(2008) Jeong-Won Yoon et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy

(2008) Wenxing Dong et al.   JOURNAL OF ELECTRONIC MATERIALS