Effect of substrates on the formation of Kirkendall voids in Sn/Cu joints

Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints

(2017) Jae-Yong Park et al.   JOURNAL OF ALLOYS AND COMPOUNDS

On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface

(2016) O.Y. Liashenko et al.   ACTA MATERIALIA

Inhibiting the growth of Cu3Sn and Kirkendall voids in the Cu/Sn-Ag-Cu system by minor Pd alloying

(2012) Cheng En Ho et al.   Electronic Materials Letters

Recrystallization-induced void migration in electroplated Cu films

(2012) Sunghwan Kim et al.   SCRIPTA MATERIALIA

Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding

(2011) Liang Yin et al.   JOURNAL OF ELECTRONIC MATERIALS

On the root cause of Kirkendall voiding in Cu3Sn

(2011) Liang Yin et al.   JOURNAL OF MATERIALS RESEARCH

Intrinsic and Interdiffusion in Cu-Sn System

(2011) Santosh Kumar et al.   JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION

Void formation at the interface in Sn/Cu solder joints

(2011) Yang Yang et al.   MICROELECTRONICS RELIABILITY

Assessing the risk of “Kirkendall voiding” in Cu3Sn

(2010) Peter Borgesen et al.   MICROELECTRONICS RELIABILITY

Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound

(2009) Eric Buchovecky et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of organic additives on preferred plane and residual stress of copper electroplated on polyimide

(2009) Jongsoo Kim et al.   MATERIALS CHEMISTRY AND PHYSICS

Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints

(2008) Jin Yu et al.   ACTA MATERIALIA

Kirkendall voids in the intermetallic layers of solder joints in MEMS

(2008) Kerstin Weinberg et al.   COMPUTATIONAL MATERIALS SCIENCE

Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

(2008) Y. Liu et al.   JOURNAL OF APPLIED ELECTROCHEMISTRY