Enhanced Interfacial Adhesion and Thermal Stability in Bismuth Telluride/Nickel/Copper Multilayer Films with Low Electrical Contact Resistance

Using high thermal stability flexible thin film thermoelectric generator at moderate temperature

(2018) Zhuang-Hao Zheng et al.   APPLIED PHYSICS LETTERS

Controlled resistive switching characteristics of ZrO2-based electrochemical metallization memory devices by modifying the thickness of the metal barrier layer

(2018) Sridhar Chandrasekaran et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Multi-component AlCrTaTiZrMo-nitride film with high diffusion resistance in copper metallization

(2018) Rongbin Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of interfacial layer-by-layer nanolayers on the stability of the Cu TSV: Diffusion barrier, adhesion, conformal coating, and mechanical property

(2018) Daekyun Jeong et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

A numerical study on the design trade-offs of a thin-film thermoelectric generator for large-area applications

(2018) Kirsi Tappura   RENEWABLE ENERGY

Nano-scratch testing of (Ti,Fe)N x thin films on silicon

(2017) B.D. Beake et al.   SURFACE & COATINGS TECHNOLOGY

A highly-efficient, concentrating-photovoltaic/thermoelectric hybrid generator

(2017) Tae-Hyeon Kil et al.   Nano Energy

Low interface resistance and excellent anti-oxidation of Al/Cu/Ni multilayer thin-film electrodes for Bi 2 Te 3 -based modules

(2017) Hongyu Zhou et al.   Nano Energy

Light-concentrated solar generator and sensor based on flexible thin-film thermoelectric device

(2017) Wei Zhu et al.   Nano Energy

Thermoelectric Devices: A Review of Devices, Architectures, and Contact Optimization

(2017) Ran He et al.   Advanced Materials Technologies

Tailoring Electrical Transport Across Metal–Thermoelectric Interfaces Using a Nanomolecular Monolayer

(2016) Thomas Cardinal et al.   ACS Applied Materials & Interfaces

Current progress and future challenges in thermoelectric power generation: From materials to devices

(2015) Weishu Liu et al.   ACTA MATERIALIA

Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate

(2015) Ju Dy Lim et al.   APPLIED SURFACE SCIENCE

NiGe/n+-Ge junctions with ultralow contact resistivity formed by two-step P-ion implantation

(2014) Masahiro Koike et al.   Applied Physics Express

Electrical Contact at the Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining

(2013) Hohyun Keum et al.   ACS Applied Materials & Interfaces

Electrical contact resistances of thermoelectric thin films measured by Kelvin probe microscopy

(2013) Miguel Muñoz-Rojo et al.   APPLIED PHYSICS LETTERS

Controlled improvement in specific contact resistivity for thermoelectric materials by ion implantation

(2013) Patrick J. Taylor et al.   APPLIED PHYSICS LETTERS

Assessment of thermal expansion coefficient for pure metals

(2013) Bo Zhang et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

Graphene for True Ohmic Contact at Metal–Semiconductor Junctions

(2013) Kyung-Eun Byun et al.   NANO LETTERS

Microstructure Contact Studies for Skutterudite Thermoelectric Devices

(2012) Degang Zhao et al.   International Journal of Applied Ceramic Technology

High-performance bulk thermoelectrics with all-scale hierarchical architectures

(2012) Kanishka Biswas et al.   NATURE

Thermal expansion of bismuth telluride

(2011) L. M. Pavlova et al.   HIGH TEMPERATURE

Thermoelectric Property Studies on Cu-Doped n-type CuxBi2Te2.7Se0.3 Nanocomposites

(2011) Wei-Shu Liu et al.   Advanced Energy Materials

Low Resistance Ohmic Contacts to Bi[sub 2]Te[sub 3] Using Ni and Co Metallization

(2010) Rahul P. Gupta et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Cu wire bond microstructure analysis and failure mechanism

(2010) Cheng-Fu Yu et al.   MICROELECTRONICS RELIABILITY

Thermal Stability of Ge2Sb2Te5 in Contact with Ti and TiN

(2009) Vijayaharan A. Venugopal et al.   JOURNAL OF ELECTRONIC MATERIALS

Small-scale energy harvesting through thermoelectric, vibration, and radiofrequency power conversion

(2008) Nicholas S. Hudak et al.   JOURNAL OF APPLIED PHYSICS

A Multiscale Model of Thermal Contact Resistance Between Rough Surfaces

(2008) Robert L. Jackson et al.   JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME

Cooling, Heating, Generating Power, and Recovering Waste Heat with Thermoelectric Systems

(2008) Lon E. Bell   SCIENCE