标题
Calculated Resistances of Single Grain Boundaries in Copper
作者
关键词
-
出版物
Physical Review Applied
Volume 2, Issue 4, Pages -
出版商
American Physical Society (APS)
发表日期
2014-10-17
DOI
10.1103/physrevapplied.2.044007
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- Grain boundary composition and conduction in HfO2: An ab initio study
- (2013) K.-H. Xue et al. APPLIED PHYSICS LETTERS
- Quantum transport theory with nonequilibrium coherent potentials
- (2013) Yu Zhu et al. PHYSICAL REVIEW B
- Quantum Transport Modeling From First Principles
- (2012) Jesse Maassen et al. PROCEEDINGS OF THE IEEE
- Low-Σ twist and tilt grain boundaries in cubic materials
- (2011) A. Morawiec JOURNAL OF APPLIED CRYSTALLOGRAPHY
- Texture and Grain Boundary Character Distribution in a Thermomechanically Processed OFHC Copper
- (2011) Khaled J. Al-Fadhalah JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME
- Grain boundary engineering: historical perspective and future prospects
- (2011) Tadao Watanabe JOURNAL OF MATERIALS SCIENCE
- A review of some elements in the history of grain boundaries, centered on Georges Friedel, the coincident ‘site’ lattice and the twin index
- (2011) O. B. M. Hardouin Duparc JOURNAL OF MATERIALS SCIENCE
- Electron scattering at surfaces and grain boundaries in Cu thin films and wires
- (2011) J. S. Chawla et al. PHYSICAL REVIEW B
- Resistivity dominated by surface scattering in sub-50 nm Cu wires
- (2010) R. L. Graham et al. APPLIED PHYSICS LETTERS
- Large Discrete Resistance Jump at Grain Boundary in Copper Nanowire
- (2010) Tae-Hwan Kim et al. NANO LETTERS
- Simulation of grain boundary effects on electronic transport in metals, and detailed causes of scattering
- (2010) Baruch Feldman et al. PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS
- Surface and grain-boundary scattering in nanometric Cu films
- (2010) Tik Sun et al. PHYSICAL REVIEW B
- An ab initio investigation on boundary resistance for metallic grains
- (2010) Ben-hu Zhou et al. SOLID STATE COMMUNICATIONS
- Size-Dependent Resistivity in Nanoscale Interconnects
- (2009) Daniel Josell et al. Annual Review of Materials Research
- Direct detection of grain boundary scattering in damascene Cu wires by nanoscale four-point probe resistance measurements
- (2009) Yusuke Kitaoka et al. APPLIED PHYSICS LETTERS
- Resistivity of thin Cu films with surface roughness
- (2009) Youqi Ke et al. PHYSICAL REVIEW B
- Five-parameter grain boundary distribution of commercially grain boundary engineered nickel and copper
- (2008) V. Randle et al. ACTA MATERIALIA
Find Funding. Review Successful Grants.
Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.
ExplorePublish scientific posters with Peeref
Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.
Learn More