Mechanical Behavior of Diamond-Sawn Multi-Crystalline Silicon Wafers and its Improvement

Published 2013 View Full Article

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Title
Mechanical Behavior of Diamond-Sawn Multi-Crystalline Silicon Wafers and its Improvement
Authors
Keywords
Multi-crystalline silicon, Diamond wire saw, Critical strain, Breakage
Journal
Silicon
Volume 6, Issue 2, Pages 129-135
Publisher
Springer Nature
Online
2013-12-16
DOI
10.1007/s12633-013-9170-2
References
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